In our SMD Assembly Line, we ensure the fast and high-quality production of your products using high-capacity and cutting-edge technology machinery.
Equipment Overview:
Destacker Empty PCB Loader
Suneast T9 Printer / DEK Printer for solder paste application
SPI BF 3SI-18 – 3D Solder Paste Inspection Machine
SM471, SM481, SMD482 Plus SMD Pick and Place Machines
NG-OK Observation Conveyors, Unloader, Loader, Tray Feeder Units
Heller 1809 MK-III Nitrogen Reflow Oven (9+1 Zone)
BTU Pyramix Reflow Oven (Zone-based configuration)
Placement Capacity:
Up to 148,000 components/hour
PCB Size Range:
Minimum: 80 x 50 x 0.4 mm (panel format)
Maximum: 510 x 460 x 4.0 mm (panel format)
Supported Component Types:
All standard SMD packages, including QFP, QFN, DFN, BGA, CSP, microBGA, and odd-shaped components.
Component Size Range:
Passive components: 01005, 0201 metric packages
ICs up to 75 mm in size
Fine-pitch components down to 0.3 mm lead pitch
Max component height: 15 mm
Placement Accuracy:
For 01005, 0201, 0402 chips: ±30 µm
For QFP (6 mm to 45 mm): ±30 µm
Feeder Types:
Tape
Stick
Tray
Programming Method:
Offline programming with optimization software
Solder Paste Application:
Fully automatic stencil printer using framed or foil stencils
Adhesive Application:
Fully automatic stencil printer with framed/foil stencils
Stencil Frame Sizes:
Minimum: 300 x 300 mm frame, 10 x 10 mm profile
Maximum: 736 x 736 mm frame, 40 x 40 mm profile
Stencil Foil Types:
Laser Cut
Electroformed
Chemically Etched
Silk Screen
Soldering & Curing:
7-Zone Full Convection Reflow Oven
Heating length: 249 cm
