What İS 5S?

Extraction

Separating the necessary from the unnecessary

Arrangement

Neatly arranging everything necessary to increase working efficiency.

Cleaning

Cleaning everything neatly and avoiding sources of pollution

Standardization

To ensure the sustainability of the first 3S and abandon its continuous development

Discipline

To make 5S a culture and to ensure its permanence.

1. Extraction;

Separate needed and unneeded materials. Keep the materials needed to do the job in the work area, and keep the others out of the work area.

2. Editing;

Put the materials that need to be on hand to get the job done within easy reach. Design these areas so that you can easily find materials. Put back any used material.

3. Cleaning;

Clean up. Always keep the working environment clean. Identify the causes of pollution.

4. Standardization;

Establish rules and procedures to keep the gains you've made with the first three steps and make it a habit.

5. Discipline;

Practice the first four S's regularly. Conduct audits at regular intervals to ensure implementation.

ESD Use in Production Areas

Depending on the amount of humidity in the environment, a person can be charged 35,000 V electrostatic voltage by walking on a carpet. The sudden discharge of electrostatic charge is expressed as ESD. Many circuit elements, components, circuits and advanced technology products are exposed to irreparable malfunctions and decreases in product quality due to the sudden change of electrostatic charge. The known truth is: The static charge needs to be discharged slowly, not suddenly, which takes place within a period of 3 seconds.

Machine Parkour

In order to always be one step ahead of the sector, we have established our new high-tech machine park and put it into service. With the IT software-based data storage system that supports our renewed machines;

With the support provided by IT-based feeder and typesetting software, material-based production tracking is provided. With the support of ERP software, the materials used for each production can be followed up to the purchasing process.

In addition, the stock system, which is configured in a way that does not allow the wrong material to be stacked, prevents mistakes by keeping track of where the material will be placed and where it will be bought. In addition, since the system is integrated with ERP, this process can also be followed.

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SMD Assembly Line

Destacker Empty Pcb Loader

Suneast T9 Printer Dek Printer solder paste machines

SPI BF 3SI-18 (3D Solder Paste Inspection Machine)

SM471 SM481 SMD482 Plus Smd Typesetting Machines

NG-OK - Observation Conveyors Unloader loader Tray Feeder

Heller 1809 MK-III Nitrogen (9+1 Zone) BTU PYRAMIX (zone) Furnaces

Our Typesetting Capacity is 148,000 components /hour

Smallest PCB Dimensions: 80 x 50 x 0.4mm (as Panel)

Largest PCB Dimensions: 510 x 460 x 4.0mm (as Panel)

Component Types: All SMD material types, QFP, QFN, DFN, BGA, CSP, microBGA, Odd Shape

Component Dimensions: (metric) 01005,0201 sheath passive components Processors up to 75mm Sensitive materials including 0.3mm leg spacing.Max. 15mm height

String Precision: +/- 30µ for Chip 01005,0201 - 0402 +/- 30µ for QFP-6mm-45mm

Feeder Types: Tape (tape), Stick (stick), Tray (tray)

String Programming Type : Offline Programming with Optimization software

Solder Paste Application: With fully automatic screen printing machine and framed/leaf sieve

Adhesive Application : With fully automatic screen printing machine and framed/leaf sieve

Sieve Frame Dimensions: The smallest - 300x300mm frame and 10x10mm profile

Largest - 736x736mm frame and 40x40mm profile

Screen Foil Cutting Types: Laser Cutting, Electroforming, Chemical Etching, Silk Screen

Soldering and Curing: With 7-Zone Full Convection, fully automatic Reflow Oven

Heating Length: 249 cm

With our experienced staff and flexible options for your TH strings, we offer you the opportunity to produce high quality flexible models with the latest technology, with our fast wave soldering option, or with daily heavy productions or with Nitrogen regional soldering service.

EBSOMAT Axial cutting machine

ITECO Radial cutting machine

SOLTEC Wave soldering machine

ECOSELECT-2

Our regional soldering capacity: 10.800-6,000 cm length/hour (Theoretical - Practical)

PCB Types: All rigid PCBs, flexible PCBs with pallet Flux Application: Fully automatic nozzle spray fluxer

Pre-Heating System: IR (Infrared) + hot air, flexible heating configuration system

Ladle Type : Double wave, oblique jet front wave, still wide unidirectional back wave With a separate easily accessible slag chamber

Card Cooling System: With air fans system

TH Type Line - Optical Control, Touch Up

System: 10-40x Zoom microscopes, magnifiers and thermal soldering irons with trained expert personnel.

Applied Standards: IPC-A-610D Acceptability of Electronic Productions IPC J-STD-001D Requirements for Soldered Electrical and Electronic Products

Recording-Documentation: Digital photographs with a microscope, Digital Microscope

Reporting System: With Production Tracking Forms and Corrective-Preventive Activity Reports

Thanks to our automatic optical inspection, or AOI machine in short, we pass your electronic printed circuit boards through the quality control stage with cameras, lighting systems and automatic image processing software. You can ensure process quality before proceeding to the next production stage. Thus, you avoid waste, remanufacturing, repair and related time losses and labor costs. Records production errors. It keeps statistics and reports common errors to improve over time.

Thanks to our Nordson Dage Quadra 3 X-ray inspection device, we provide high quality X-ray inspection for production line quality control. The BGA, QFN and IGBT attachment allows to detect a wide range of manufacturing defects such as PTH filling, detection of voids in solder, interfacial discharge, component fragmentation, and counterfeit device scanning.

Thanks to our BGA Rework station; We can disassemble and install your sensitive component repairs in a controlled manner without damaging the pcb and component.

Our ERSA IR550 Device;

Component placement feature with +/- 0.025 sensitivity, one infrared and one K-Type temperature meter, and a sensitive temperature measurement feature are available. It provides 18x optical 4x digital zoom adjustment.

SuperSwash is an ideal washing machine for cleaning medium and high volume electronic assemblies and for cleaning high volume stencils.

Excellent cleaning performance

easy operation

Zero discharge concept

Linear direct spray for even washing

Illuminated glass door chamber for visual process control

Quick switch to Twingo - dual capacity configuration

Wide range of standard and customized PCBA fixtures

Simple detailed programming

Complete data recording and barcode traceability

Low chemical and water consumption

Outstanding options for water use

Adaptive rinse water quality control

Automatic chemical concentration control

The iCoat-3 is designed to strike a balance between coating and performance. This selective conformal coating machine has single-axis and 3-axis servo-controlled double valve structure.

With the Anda I COAT-3 Regional Conformal Coating Machine, the desired regions of the cards are coated with the desired coating type in accordance with the standards. Components up to a height of ± 90 mm are coated without any problems. By using Aselsan approved acrylic coating, the coating process is applied between the desired coating thickness values.

Brands are printed on the electronic card boxes upon request.

Mimaki's unique anti-banding feature is designed to prevent MAPS banding from occurring.

LD Mode allows printing even on rough surfaces with material thickness differences of up to 4.4 mm without any change in print quality.

Patterns are created by repeating MFD - Mimaki Fine Diffusion Technology Technique.

Incorrect pattern distribution creates image noise, even in high-performance printing machines, resulting in uneven color prints and tonal transitions.

New RasterLink 6 software *patented* MFD image processing technology improves print quality by reducing image noise caused by repeating patterns.

MFD is used in Version 4.0 and above.